Description
5pack of 1.5g metal oxide based thermal grease/glue compound works wheat sink to improve heat dissipation from CPUs/GPUs and other integrated computer chips High performance silver paste operates in temperatures of 22F to 365F (30C to 180C) Resealable syringe prevents drying 5Pack ideal for multi workstation distribution 46 applications per tube for 2030 applications in total Thermal conductivity of 3.07 W/mK at 25 C or greater CE and RoHs Certified TAA Compliant
